Pack Expo 2016 to host inaugural networking fair

Oct. 28, 2016 – The inaugural NextGen Networking Fair, a new event from PMMI, a trade association for packaging and processing technologies, promises to offer a “one-of-a-kind” matchmaking opportunity for Pack Expo International and co-located Pharma Expo 2016 exhibitors and attendees to connect with students from packaging, processing, materials, package design and mechatronics programs.

Sponsored by B&R Industrial Automation, the event debuts on November 6 from 3:00–5:00 p.m. in the Education & Workforce Development Pavilion, in the North Mezzanine of the McCormick Place in Chicago, Ill.

“With the Baby Boomer generation increasingly opting for retirement, employers are looking for fresh talent to design, build, operate and service their highly advanced and automated packaging and processing systems. Recruiting and retaining capable new employees results in an important competitive advantage,” said Patricia Andersen, PMMI Education & Workforce Development Committee Chair.

Taking place November 6-9, Pack Expo will bring together 50,000 attendees from 40+ vertical markets, 7,000 international buyers from 130+ countries, and more than 2,300 exhibiting companies.