Manufacturing AUTOMATION

Beckhoff expands industrial PC line with ultra-compact C6032

April 23, 2019
By Manufacturing AUTOMATION

April 23, 2019 – Beckhoff Automation has introduced the new, ultra-compact C6032 industrial PC (IPC).

With dimensions of only 129 x 133 x 104 mm, the C6032 IPC enhances the scalability of the PC-based controller portfolio from Beckhoff. The C6032 adds two slots for PCIe Compact modules to the C6030 single-board IPC, which is comparable in terms of computing power, to accommodate modular interfaces and functional extensions. 

Equipped with powerful Intel Core i processors of the 6th and 7th generation – up to the Core i7 with four 3.6 GHz cores – the C6032 is ideal to support extensive multi-axis motion control, complex HMI applications, extremely short cycle times and handling of large data volumes.

The compact motherboard and the die-cast zinc and robust aluminum housing are of compact design typical of the ultra-compact C60xx IPC series. Other features include the flexible installation options with vertical or horizontal mounting at the rear of the enclosure – and a totally free orientation of the connection area.


The first available PCIe modules are the following: 2 x Gbit Ethernet, 2 x USB 3.0, 2 x RS232 and 1 x CP-Link 4 (for connection to Beckhoff industrial displays).

The use of a speed-monitored and controlled fan makes the C6032 suitable for an operating temperature range of up to 55 degrees Celsius. Available options include Windows 7 or Windows 10 operating systems as well as a second M.2 SSD in RAID configuration. The C6032 also offers storage capacity of 40 GB M.2 SSD, 3D flash even in the basic configuration.

The Microsoft Azure–certified devices in the C60xx IPC series are ideal to meet current requirements in machine building, such as increasing modularity, reduced space requirements in control cabinets and increased computing power at an affordable price point. Designed exactly with all these requirements in mind, the new device generation is suitable for use in a broad range of application scenarios, including distributed architectures and current Internet of Things (IoT) or Industry 4.0 concepts.

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