Manufacturing AUTOMATION

Balluff debuts wafer mapping sensor for small spaces

January 20, 2020
By Kristina Urquhart


Balluff’s new wafer mapping sensor, BOH00EZ, uses a precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.

Especially designed for use with extremely thin end effectors, it features a controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

Based on photoelectric Micromote technology, it features the smallest LED sensor on the market in a small sensor head – measuring just 2.4 x 1.5 x 7 mm. This allows it to deliver precision in even the smallest spaces.

In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as life science and food and beverage applications.


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