Manufacturing AUTOMATION

Siemens partners with Foxconn team up to define smart manufacturing processes

May 16, 2024
By Manufacturing AUTOMATION

Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn) and Cedrik Neike, CEO of Digital Industries and Member of the managing board of Siemens AG signing MoU. (Photo: Siemens)

Siemens and Hon Hai Technology Group (Foxconn), a global electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.

According to a Siemens press statement, the collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem.

“We believe in the power of ecosystems to drive digital and sustainability transformation and scale technology. Our partnership underscores our commitment to shape the future of electronics manufacturing. We will support customers with greater efficiency and speed due to optimized engineering and manufacturing workflows,” said Roland Busch, president and CEO of Siemens.

The collaboration focuses on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV). Siemens and Foxconn are working together to establish a scalable and seamless engineering and manufacturing ecosystem.

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Roland Busch, President and CEO of Siemens AG emphasized the significance of this partnership: “We believe in the power of ecosystems to drive digital and sustainability transformation and scale technology. Our partnership underscores our commitment to shape the future of electronics manufacturing. We will support customers with greater efficiency and speed due to optimized engineering and manufacturing workflows.”

This MoU reportedly identifies key collaboration areas to increase the level of automation within Foxconn’s facilities. These areas include electronics manufacturing services (EMS) and contract design and manufacturing service (CDMS). Both companies will explore initiatives to work towards the factory of the future by implementing Siemens’ factory automation portfolio and industrial software, including building blocks such as digital twin technology and artificial intelligence (AI). Siemens Xcelerator, with its suite of software and solutions, will play a pivotal role in optimizing Foxconn’s engineering and manufacturing workflows.

The collaboration aims to leverage how Siemens’ technical expertise can enhance Foxconn’s sustainability performance. This partnership involves establishing transparent monitoring processes and applying professional services and digital solutions.


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