Communications & Networks
Beckhoff to highlight smart factory solutions at Pack Expo 2016
October 28, 2016 by Manufacturing AUTOMATION
Oct. 28, 2016 – Beckhoff Automation says it plans to showcase system-integrated solutions for IoT and Industrie 4.0 at next month’s Pack Expo in Chicago, Ill.
Booth visitors will have the opportunity to use their own smartphones to interact with PC-based control demos – including the ability to connect with a wall of IoT-enabled devices and a six-axis robot arm using any mobile device with a web browser. Beckhoff will also show an advanced augmented reality and wearable HMI proof of concept in the form of Microsoft HoloLens connected to Beckhoff IoT demos. In addition, new I/O solutions have been introduced in the form of the Beckhoff IoT Bus Coupler and IoT Box. These provide a “simple method” to directly connect I/O systems to the Cloud and securely transmit data over today’s recognized standards such as OPC-UA, AMQP and MQTT, says the company.