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Balluff debuts two new distance sensors for assembly applications


May 6, 2020
By Manufacturing AUTOMATION

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Balluff has released two new variations in its line of distance sensors for assembly applications.

The BOD002M offers a 50 to 100 mm working distance and a resolution down to 10 μm, and the BOD002N with a 50 to 650 mm working distance and a resolution down to 100 μm, combining the output modes of three previous models into one.

Other improvements include an upgrade to IO-Link v1.1, an OLED display instead of an LCD, and a class 1 laser.

The sensor provides ambient light suppression as well as filtering to eliminate possible interference, which is especially helpful when working with challenging targets such as those with reflective or black material.

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The sensor also includes a precision mode for high accuracy at reduced processing speed. Setting the various modes and functions can be done through IO-Link or, alternately, with push buttons and the integrated display.